Vacuum mold is also called vacuum injection mold. It is the process of defoaming, mixing, preheating and molding the castable under vacuum, and the second curing process of 2-3 hours in a constant temperature box of 60 ℃ - 80 ℃. This method is especially suitable for small batch production. It is a low cost plan to deal with trial production and small batch production in a short time, and it can also satisfy the functional test proofing of some more complex engineering samples.

　　硅膠模則是真空腹膜中的一種在短時刻內(nèi)處理功能性產(chǎn)品的小批量出產(chǎn)的低本錢計劃。從軟膠到硬塑，廣泛的可供挑選的樹脂資料使硅膠復模的產(chǎn)品簡直能夠和注塑件相媲美。此外，高質(zhì)量的外表和較低價的本錢優(yōu)勢也是小批量出產(chǎn)，市場推廣，功能測驗，參展樣品的 挑選。

　　Silica gel mold is a kind of low cost plan for small batch production of functional products in a short time. From soft rubber to hard plastic, a wide range of resin materials can be selected to make silica gel replica products comparable to injection molded parts. In addition, high quality appearance and low cost advantage are also small batch production, marketing, function test, selection of exhibition samples.

　　硅膠復模過程？每個硅膠模能出多少產(chǎn)品？

　　Silicone replica process? How many products can each silica gel mold produce?

　　使用原有的樣板，在真空狀態(tài)下制造出硅膠模具，并在真空狀態(tài)下選用PU資料進行澆注，從而克隆出與原樣板相同的仿制件。該項技能由于速度快、本錢底、大大降低了產(chǎn)品的開發(fā)費用、周期和危險。制造硅膠模具的資料有：國產(chǎn)硅膠、進口硅膠、通明硅膠、特種硅膠。仿制產(chǎn)品選用資料：國產(chǎn) PU 、進口 PU 、通明 PU 、軟 PU 、賽鋼、 ABS、PP、PC耐高溫的ABS 等.長處是時刻快，花費少，加工失敗幾率小等。

　　Using the original template, the silica gel mold is made in vacuum state, and PU material is used for pouring in vacuum state, so that the same imitation parts as the original template are cloned. This skill greatly reduces the cost, cycle and danger of product development due to its fast speed and low cost. The materials for making silica gel mould include: domestic silica gel, imported silica gel, transparent silica gel and special silica gel. Selection data of imitated products: domestic PU, imported Pu, Tongming Pu, soft PU, saigang, ABS, PP, PC high temperature resistant ABS, etc. the advantages are fast time, low cost, small processing failure probability, etc.